April 2023

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April 20, 2023

Teledyne FLIR Adds Development Kits for Hadron 640R Dual Camera Module Integration for Qualcomm and NVIDIA Embedded Systems

Teledyne FLIR releases Development board for quick integration of the performance-leading FLIR Hadron 640R thermal and visible dual camera module

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April 3, 2023

Teledyne FLIR Adds New Boson+ Thermal Resolution Options, Radiometry, and MIPI Interface Simplifying Embedded System Integration

Boson+ customers gain access to the US-based Teledyne FLIR Technical Services team for integration support, which reduces development risk and shortens time to market.