Teledyne FLIR BOSON 640 x 512 18mm 24° HFoV – Shutterless LWIR Thermal Camera Core

  • Resolution: 640×512 – 24° HFoV
  • Shutterless
  • Short Lens
  • 12 µm pixel pitch VOx microbolometer
  • 21 x 21 x 11 mm, (4.9 cm3 ) camera body
  • Weight as low as 7.5 grams
  • Low power consumption, starting at 500 mW
  • Rugged construction and highest temperature rating -40°C to +80°C

Consumer Grade <60mK NEDT  SKU:21640A024-6CAAX – $4104.00
Professional Grade <50mK NEDT  SKU:21640A024-6PAAX – $5130.00
Industrial Grade <40mK NEDT  SKU:21640A024-6IAAX – $6156.00

$4,104.00$6,156.00

We usually have a majority of these items in stock.
Please call or contact us for availability.

Quantity5 +
Price$3,898.80 - $5,848.20
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Boson+/Boson Comparison

FLIR Boson® – 18mm Lens

Compact Shutterless LWIR Thermal Camera

The Boson® longwave infrared (LWIR) thermal camera module sets a new standard for size, weight, power, and performance (SWaP). It utilizes FLIR infrared video processing architecture to enable advanced image processing and several industry-standard communication interfaces while keeping power consumption low. The 12 µm pitch Vanadium Oxide (VOx) uncooled detector comes in two resolutions – 640 x 512 or 320 x 256. It is available with multiple lens configurations, adding flexibility to integration programs.

With a weight as low as 7.5 g and a camera body as small as 21 x 21 x 11 mm, the Boson represents an industry-leading reduction in SWaP with no reduction in performance. Advanced embedded processing and video analytics, as well as software-customizable functionality, give this small camera big capabilities, including integration with auxiliary sensors such as third-party cameras, GPS, and IMU.


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DRAMATIC REDUCTION IN SIZE, WEIGHT AND POWER (SWaP) WITH NO REDUCTION IN PERFORMANCE A full-featured VGA thermal camera module at less than 4.9 cm3.

  • 21 x 21 x 11 mm camera body and weight as low as 7.5 g.
  • Low power consumption, starting at 500 mW
  • 12 µm pixel pitch VOx microbolometer with 320 and 640 resolutions.
  • Rugged construction and highest temperature rating -40°C to 80°C.
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POWERFUL INFRARED VIDEO PROCESSING ARCHITECTURE FLIR infrared video processing with embedded industry-standard interfaces empowers advanced processing and analytics.

  • Includes embedded algorithms for noise filters, gain control, blending, and more.
  • Software-customizable functionality for video processing and power dissipation requirements.
  • Built-in support for physical and protocol-level interface standards.
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WIDE CONFIGURABILITY FOR FASTER DEVELOPMENT AND LOWER COST-TO-MARKET Unprecedented integration flexibility for fast, affordable developments.

  • Customized applications through FLIR-trusted third party developers.
  • Mechanical/electrical compatibility across all versions.
  • Variety of hardware and image processing integration to fit OEM requirements.

IDD CAD Data Boson 640SL - 18mm-f1.1

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Teledyne FLIR Boson Datasheet

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Boson Family Brochure

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Boson Comparison
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Boson
Resolution VGA: 640 × 512 | QVGA: 320 × 256 VGA: 640 × 512 | QVGA: 320 × 256
Pixel Size 12 μm 12 μm
Spectral Band 8μm - 14μm 8μm - 14μm
Thermal Sensitivity Industrial: ≤20 mK | Professional: ≤30 mK Industrial: ≤40 mK | Professional: ≤50 mK | Consumer: ≤60 mK
Video Pipeline & Latency AGC: Improved with deeper blacks | Latency: <6 ms AGC: Yes | Latency: <25 ms
Scene Dynamic Range High Gain: up to 150 °C | Low Gain: up to 350 °C High Gain: <140 °C | Low Gain: <500 °C
Frame Rate 60Hz default; 30 Hz runtime selectable 60 Hz & 9 Hz
Radiometry Option Yes Yes
Low-Gain Mode Available Yes Yes
Shutterless Options Yes Yes
BOSON+ Boson