FLIR Boson+ 73mm Lens

High Performance, Uncooled, Longwave Infrared (LWIR) OEM Thermal Camera Module

Made in USA, the Boson+ sets a new industry standard for longwave infrared (LWIR) OEM thermal camera performance and size, weight, and power (SWaP). It features an industry-leading thermal sensitivity of less than or equal to (≤)20 mK and an upgraded automatic gain control (AGC) filter delivering dramatically enhanced scene contrast and sharpness in all environments. Improved video latency enhances tracking, seeker performance, and decision support. With an optimized 12 µm 640 x 512 focal plane array (FPA) and AGC, Boson+ is now even more the go-to thermal camera module for defense, industrial, and commercial integrators. Boson+ maintains the widely deployed and real-world-proven Teledyne FLIR Boson mechanical, electrical, and optical interfaces allowing plug-and-play with existing designs. The easy-to-use Boson SDK, user-friendly GUI, and comprehensive product integration documentation further simplify OEM integrated into a new system designs. Enhanced LWIR thermal performance and industry-leading reliability provide low-risk development, making Boson+ the ideal dual use thermal camera module for integration into unmanned ground vehicles (UGV), unmanned aircraft systems (UAS), wearables, security applications, handhelds, and thermal sights.

ADVANCED PERFORMANCE WITH IMPROVED THERMAL SENSITIVITY CONTRAST, AND LATENCY Industry leading NEDT of ≤20 mK extends thermal scene details and detection, recognition, and identification (DRI) performance.

≤20 mK thermal sensitivity
Improved latency for faster decision support
12 µm pixel pitch VOx microbolometer with 320 and 640 resolutions.
Upgraded automatic gain control (AGC) provides blacker blacks and whiter whites

POWERFUL INFRARED VIDEO PROCESSING ARCHITECTURE FLIR infrared video processing with embedded industry-standard interfaces empowers advanced processing and analytics.

Low power consumption, starting at 900 mW
Compact, 640x512 resolution, 12 μm pixel pitch LWIR microbolometer
Rugged construction and operating temperature rating of -40 °C to 80 °C

DESIGNED FOR INTEGRATORS Shared mechanical/electrical compatibility across all Boson provides plug-and-play with existing designs.

Comprehensive product integration documentation and easy-to-use Boson GUI.
Highly qualified Technical Services team available to support integration
Manufactured in the USA, dual use, and classified under US Department of Commerce jurisdiction as EAR 6A003.b.4.a
Flexible USB and CMOS or USB and MIPI interface

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Teledyne FLIR BOSON+ 640 x 512 73mm 5.5° HFoV - LWIR Thermal Camera Core

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