Teledyne FLIR BOSON 320 x 256 2.3mm 92° HFoV – LWIR Thermal Camera Core

  • Resolution: 320×256 – 92° HFoV
  • 2.3mm Focal Length
  • 12 µm pixel pitch VOx microbolometer
  • 21 x 21 x 11 mm, (4.9 cm3 ) camera body
  • Weight as low as 7.5 grams
  • Low power consumption, starting at 500 mW
  • Rugged construction and highest temperature rating -40 °C to +80 °C
  • Consumer Grade <60mK NEDT SKU:20320H092-6CAAX – $1959.00
  • Professional Grade <50mK NEDT SKU:20320H092-6PAAX – $2449.00
  • Industrial Grade <40mK NEDT SKU:20320H092-6IAAX – $2938.00

Interfaces and Accessories sold separately.

$1,959.00$2,938.00

Quantity5 +
Price$1,861.05 - $2,791.10
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Boson+/Boson Comparison

FLIR Boson® – 2.3mm Lens

Compact LWIR Thermal Camera

The Boson® longwave infrared (LWIR) thermal camera module sets a new standard for size, weight, power, and performance (SWaP). It utilizes FLIR infrared video processing architecture to enable advanced image processing and several industry-standard communication interfaces while keeping power consumption low. The 12 µm pitch Vanadium Oxide (VOx) uncooled detector comes in two resolutions – 640 x 512 or 320 x 256. It is available with multiple lens configurations, adding flexibility to integration programs. With a weight as low as 7.5g and a camera body as small as 21 x 21 x 11 mm, the Boson represents an industry-leading reduction in SWaP with no reduction in performance. Advanced embedded processing and video analytics, as well as software-customizable functionality, give this small camera big capabilities, including integration with auxiliary sensors such as third-party cameras, GPS, and IMU.


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DRAMATIC REDUCTION IN SIZE, WEIGHT AND POWER (SWaP) WITH NO REDUCTION IN PERFORMANCEA full-featured VGA thermal camera module at less than 4.9 cm3.

  • 21 x 21 x 11 mm camera body and weight as low as 7.5g.
  • Low power consumption, starting at 500 mW
  • 12 µm pixel pitch VOx microbolometer with 320 and 640 resolutions.
  • Rugged construction and highest temperature rating -40 °C to 80 °C.
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POWERFUL INFRARED VIDEO PROCESSING ARCHITECTUREFLIR infrared video processing with embedded industry-standard interfaces empowers advanced processing and analytics.

  • Includes embedded algorithms for noise filters, gain control, blending, and more.
  • Software-customizable functionality for video processing and power dissipation requirements.
  • Built-in support for physical and protocol-level interface standards.
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WIDE CONFIGURABILITY FOR FASTER DEVELOPMENT AND LOWER COST-TO-MARKETUnprecedented integration flexibility for fast, affordable developments.

  • Customized applications through FLIR-trusted third party developers.
  • Mechanical/electrical compatibility across all versions.
  • Variety of hardware and image processing integration to fit OEM requirements.

IDD CAD Data Boson 320 - 2.3mm-f1.0

This IDD CAD Data package includes a comprehensive set of design resources, featuring a .STEP file and an accompanying PDF. The .STEP file provides a detailed 3D model that ensures compatibility with various CAD software, facilitating seamless integration into your projects. The PDF offers essential documentation, including specifications, dimensions, and guidelines to help you make the most of the provided CAD data. Download the zip file to access these valuable resources for your design and engineering needs.

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Teledyne FLIR Boson Datasheet

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Boson Family Brochure

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Boson Comparison
Boson+
Boson
Resolution VGA: 640 × 512 | QVGA: 320 × 256 VGA: 640 × 512 | QVGA: 320 × 256
Pixel Size 12 μm 12 μm
Spectral Band 8μm - 14μm 8μm - 14μm
Thermal Sensitivity Industrial: ≤20 mK | Professional: ≤30 mK Industrial: ≤40 mK | Professional: ≤50 mK | Consumer: ≤60 mK
Video Pipeline & Latency AGC: Improved with deeper blacks | Latency: <6 ms AGC: Yes | Latency: <25 ms
Scene Dynamic Range High Gain: up to 150 °C | Low Gain: up to 350 °C High Gain: <140 °C | Low Gain: <500 °C
Frame Rate 60Hz default; 30 Hz runtime selectable 60 Hz & 9 Hz
Radiometry Option Yes Yes
Low-Gain Mode Available Yes Yes
Shutterless Options Yes Yes
BOSON+ Boson