Teledyne FLIR BOSON 320 x 256 36mm 6.1° HFoV – LWIR Thermal Camera Core
- Resolution: 320 x 256 – 6.1° HFoV
- 36mm Focal Length
- 12 µm pixel pitch VOx microbolometer
- 21 x 21 x 11 mm, (4.9 cm3) camera body
- Weight as low as 7.5 grams
- Low power consumption, starting at 500 mW
- Rugged construction and highest temperature rating -40 °C to +80 °C
- Consumer Grade<60mK NEDT SKU:20320A006-6CAAX – $2612.00
- Professional Grade <50mK NEDT SKU:20320A006-6PAAX – $3265.00
- Industrial Grade <40mK NEDT SKU:20320A006-6IAAX – $3918.00
Interfaces and Accessories sold separately.
FLIR Boson® – 36mm Lens
Compact LWIR Thermal Camera
The Boson® longwave infrared (LWIR) thermal camera module sets a new standard for size, weight, power, and performance (SWaP). It utilizes FLIR infrared video processing architecture to enable advanced image processing and several industry-standard communication interfaces while keeping power consumption low. The 12 µm pitch Vanadium Oxide (VOx) uncooled detector comes in two resolutions – 640 x 512 or 320 x 256. It is available with multiple lens configurations, adding flexibility to integration programs.
With a weight as low as 7.5g and a camera body as small as 21 x 21 x 11 mm, the Boson represents an industry-leading reduction in SWaP with no reduction in performance. Advanced embedded processing and video analytics, as well as software-customizable functionality, give this small camera big capabilities, including integration with auxiliary sensors such as third-party cameras, GPS, and IMU.

DRAMATIC REDUCTION IN SIZE, WEIGHT AND POWER (SWaP) WITH NO REDUCTION IN PERFORMANCE A full-featured VGA thermal camera module at less than 4.9 cm3.
- 21 x 21 x 11 mm camera body and weight as low as 7.5g.
- Low power consumption, starting at 500 mW
- 12 µm pixel pitch VOx microbolometer with 320 and 640 resolutions.
- Rugged construction and highest temperature rating -40 °C to 80 °C.

POWERFUL INFRARED VIDEO PROCESSING ARCHITECTURE FLIR infrared video processing with embedded industry-standard interfaces empowers advanced processing and analytics.
- Includes embedded algorithms for noise filters, gain control, blending, and more.
- Software-customizable functionality for video processing and power dissipation requirements.
- Built-in support for physical and protocol-level interface standards.

WIDE CONFIGURABILITY FOR FASTER DEVELOPMENT AND LOWER COST-TO-MARKET Unprecedented integration flexibility for fast, affordable developments.
- Customized applications through FLIR-trusted third party developers.
- Mechanical/electrical compatibility across all versions.
- Variety of hardware and image processing integration to fit OEM requirements.
Resolution | |
---|---|
Pixel Pitch | |
Spectral Band | |
Noise Level (NEdT Value) |
Consumer Grade <60 mK NEDT, Professional Grade <50 mK NEDT, Industrial Grade <40 mK NEDT |
Frame Rate Option |
<9 Hz Slow Frame Rate, 60Hz default; 30 Hz runtime selectable |
Shutter | |
Solar protection | |
Continuous Digital Zoom | |
Symbology |
Re-writable each frame; alpha blending for translucent overlay |
Radiometry | |
Scene Dynamic Range | |
Temperature Accuracy | |
Field of View | |
Focal Length | |
Short Lens | |
f-number | |
Dimensions (L x W x H) | |
Weight | |
Precision Mounting Holes |
Four tapped M1.6 x 0.35 (rear cover). Lens support recommended when lens mass exceeds core mass. |
Input Voltage | |
Power Dissipation |
Varies by configuration. 320+ as low as 500 mW, 640+ as low as 1000 mW |
Video Channels | |
Control Channels | |
Configurable GPIO |
Up to 11; user configurable |
Operating Temperature Range | |
Non-Operating Temperature Range | |
Shock | |
Operational Altitude |
12 km (max altitude of a commercial airliner or airborne platform) |
Boson Enclosure Compatible |